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Ensuring Semiconductor Package Integrity with Pressure Decay Testing Instrument

Ensuring Semiconductor Package Integrity with Pressure Decay Testing Instrument

50000 USD ($)/Set

Product Details:

  • Number of Specimens 1 per Test Cycle
  • Power Supply AC Mains
  • Specimen Size Up to 100 mm 100 mm
  • Test Material Semiconductor Packages (Plastic, Ceramic, Metal)
  • Temperature 10C 40C
  • Operating Temperature 10C 40C
  • Test Range 0 1.0 MPa
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Ensuring Semiconductor Package Integrity with Pressure Decay Testing Instrument Price And Quantity

  • 1 Set
  • 50000.00 - 100000.00 USD ($)/Set
  • 50000 USD ($)/Set

Ensuring Semiconductor Package Integrity with Pressure Decay Testing Instrument Product Specifications

  • Semiconductor Packages (Plastic, Ceramic, Metal)
  • Industrial-Grade Stainless Steel
  • Up to 100 mm 100 mm
  • 8.5 kg
  • AC Mains
  • 1/8 inch NPT
  • 1 per Test Cycle
  • Automatic / Manual Switchable
  • 85% RH
  • Pressure Decay Leak Tester
  • Semiconductor Package Sealing Integrity Testing
  • 0.2% of Reading
  • 1 second
  • Digital LCD Touchscreen
  • High-Precision Piezoelectric Sensor
  • Dry Air / Nitrogen
  • Adjustable up to 1.0 MPa
  • 0 1.0 MPa
  • 10C 40C
  • 100 mm 100 mm
  • 10C 40C
  • 220V AC, 50Hz

Product Description

Featuresnote1

Batch Testing

  • Equipped with fully-automatic gravity fed sample feeder, which is Labthinks latest scientific and technological achievement that can facilitate continuous testing of 20 to 120 samples.
  • A & B dual-channel design can test samples of two different specifications simultaneously.
  • The target vacuum degree can be set by the operator to meet testing requirements of different samples.
  • Dual methods of vacuum decay and pressure decay provide the flexibility to accommodate various types of package samples.

Precise Data

  • Advanced pressure detection technology, using world renowned components for data stability which is not affected by ambient environment.
  • Advanced microflow automatic flow control technology that can accurately simulate different sizes of leakage holes without manual adjustment.
  • Both the differential pressure transducer and flow meter are traceable to NIST.
  • The system can achieve a higher test repeatability of 1um.

Intelligent Control

  • 15.6" embedded touch tablet computer with Windows OS.
  • New longitudinal interface layout, and easy to use graphic user interface.
  • Automatic alarm, automatic capture, automatic collection of unqualified samples.
  • The pressure curve is displayed in real time, and the test results are counted automatically.
  • Leakage rates are calculated automatically.
  • The system is equipped with various sensors as intelligent reminders for safer operation and control.
  • Universal printer can be connected for test results output.
  • The system features embedded with USB and network ports to facilitate the external access and data transmission of the system, which can be upgraded remotely

Security Compliance

  • Verified by compensation and calibration methods.
  • The leak tester meets GMP requirements for data traceability and meets the needs of the pharmaceutical industry.
  • User operation permission is managed at multiple levels, and the permission content can be configured on demand.
  • Electronic signature is designed according to the standard requirements of 21 CFR Part11.

Test Principle

The sample is placed in the sample feeder and automatically delivered into the test cell. The leak rate and other results can be calculated and obtained by analyzing pressure changes measured by the sensor.

Reference Standards

ASTM F2338, YY-T 0681.18, and USP<1207>

Applications

Basic Applications Vials Various vial sealing test.
Extended Applications Ampoule Various ampoule bottle sealing tests.
Cartridge Bottles Various cartridge bottle sealing tests.
Injection bottles Various injection bottles sealing test.

Technical Parameters

Table 1: Test Parameters Note2

ParameterModel C690H
Testing Range um(Reference aperture size USP1207) 3i8igreat leakage
Detection Lower Limit um 3
Resolution um 0.1
Repeatability um 1
Pressure Range kPa -100i0ii14100
Extended Functions 21 CFR Part11 Optional
GMP computer system requirements Optional

Table 2: Technical Specifications

Testing Cell 1 set for A group and 1 set for B group
Sample Feeder 1 set for A group and 1 set for B group
Sample Size I45 mm80mmNote3
Sample Quantity 20120 pieces
Gas Specifications Compressed Air (Gas source is provided by the user)
Gas Source Pressure 40.6 PSI / 500 kPa
Port Size I6 mm Polyurethane tube
Dimensions 33.4 H x 19.6 W x 28.7 D (85cm 50cm 73cm)
Power 120VAC10% 60Hz / 220VAC10% 50Hzi14select one from the twoi14
Net weight 209Lbs (95kg)

Product Configuration

Standard Configuration Mainframe, embedded tablet computer, software, flow meter, European vacuum pump, I6 mm polyurethane tube
Customization Test cell and sample feeder of group A, test cell and sample feeder of group B, negative standard reference sample and positive standard reference sample designed according to sample specifications
Optional Parts GMP computer system requirements, 21 CFR Part11, air compressor, IQ/OQ/PQ documents

Note 1: The described product characteristics are subject to the specific annotation of the "Technical Parameters" table.
Note 2: The parameters in the table are measured in the Labthink laboratory by professional operators according to the requirements and conditions of the relevant laboratory environmental standards.
Note 3: Group C test cell can be customized for samples beyond the "Sample Size", but the lower detection limit and test range will change according to the sample size, and the actual delivery shall prevail.



Advanced Leak Detection for Semiconductor Packages

Engineered for high-precision pressure decay testing, this device safeguards semiconductor package integrity. The instrument's sensitive piezoelectric sensor ensures accurate detection of even the smallest leaks, supporting a broad test range up to 1.0 MPa and confirming compliance with stringent industry standards. Suitable for plastic, ceramic, and metal packages, it delivers practical, repeatable, and robust results.


User-Friendly Operation and Maintenance

A digital LCD touchscreen interface streamlines test configuration and management, with automatic or manual mode switching according to workflow needs. Efficient data handling via RS-232/USB and comprehensive, embedded compliance reporting simplify audits. Tool-free maintenance access reduces downtime, while intuitive user calibration ensures accuracy over time.


Safety and Productivity Combined

The system integrates over-pressure shut-off, circuit protection, and low-noise operation (<60 dB(A)) to promote safe, reliable testing environments. With audio/visual alarms, swift response time, and robust stainless steel construction, operators benefit from improved productivity and confidence in results.

FAQ's of Ensuring Semiconductor Package Integrity with Pressure Decay Testing Instrument:


Q: How does the pressure decay testing instrument ensure the integrity of semiconductor package seals?

A: The instrument measures minute pressure drops within a sealed package environment using a high-precision piezoelectric sensor (0.001 MPa resolution). Any decay in pressure during a test cycle indicates potential leaks, enabling early detection and preventing compromised semiconductor packages from entering the supply chain.

Q: What materials and package sizes are compatible with this leak tester?

A: This device supports testing on semiconductor packages made from plastic, ceramic, or metal, as long as their size does not exceed 100 mm 100 mm. Its adjustable pedestal and 1/8 inch NPT port accommodate a variety of package designs within these parameters.

Q: When should manufacturers perform leak tests using this instrument?

A: Leak tests are best conducted after the package sealing process and before final product assembly or shipment. Routine in-process and final inspection testing ensures consistent product quality and adherence to industry standards for semiconductor devices.

Q: Where can the pressure decay testing instrument be deployed within the production line?

A: Designed for operation in cleanroom or controlled industrial settings, the instrument's compact dimensions (350 mm 300 mm 420 mm) and quiet operation facilitate flexible deployment at various stages of semiconductor packaging lines, including quality control stations and R&D labs.

Q: What is the testing process and how is data managed?

A: Testing involves placing a specimen on the pedestal, selecting dry air or nitrogen as the medium, and initiating the test via the touchscreen. The device automatically records results (up to 10,000 records) and exports data using RS-232/USB interfaces. Embedded compliance reports assist with traceability and regulatory audits.

Q: How easy is it to maintain and calibrate the device?

A: Routine maintenance is straightforward thanks to tool-free access panels. User calibration is supported via the touchscreen interface, ensuring ongoing accuracy without the need for specialized service technicians.

Q: What benefits does this pressure decay tester provide to semiconductor manufacturers?

A: Manufacturers gain enhanced confidence in package sealing integrity, reduced risk of product recalls, streamlined recordkeeping, and safer, more efficient testing workflows. Integrated alarms, rapid response, and robust build quality further contribute to operational reliability and regulatory compliance.

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